Compared with 4G, 5G is a qualitative leap. Relevant data shows that 5G communication uses the millimeter wave band. The advantage is that it has a fast transmission speed, which is 100 times that of 4G, which means that a high-definition movie can be downloaded in one second. However, behind this high speed, problems such as poor penetration of high-frequency millimeter waves and large heat generation are brought about.

Because of this, 5G requires that the dielectric constant and dielectric loss of the propagation medium material be small and stable in a wide frequency range. At the same time, in order to ensure the high temperature performance of electronic equipment, the requirements for the thermal conductivity of materials and the thermal stability of long-term work are gradually increasing. Boron Nitride

At the "2020 5G Base Station Key Components and Materials Summit Forum", Wen Guang, secretary general of the Shenzhen Polymer Industry Association, summarized the requirements of 5G for polymer materials, as follows:

For this reason, the development of polymer composite materials with high thermal conductivity and low dielectric constant is necessary for the development of the 5G electronics industry.

In order to obtain polymer composites with high thermal conductivity and low dielectric, suitable polymer materials must be selected first. However, when the dielectric and thermal conductivity of pure plastics cannot meet specific requirements, fillers are often needed to complete the "great cause".

Among the available fillers, boron nitride can not only effectively reduce the dielectric constant but also meet the thermal conductivity requirements. Its dielectric constant is only 1.6, which is lower than that of any resin. It has high temperature resistance and electrical breakdown strength, and its thermal conductivity is as high as that of metal (60~300W/mK). It is a very ideal light质 Packing.

However, the use of boron nitride is not without its shortcomings. In addition to being expensive, it is also related to its molecular structure-because BN has better chemical stability and is not easy to form chemical bonds, it has fewer hydroxyl groups on the edge and lower activity. Therefore, if it does not undergo any treatment, it is difficult to be infiltrated and compatible with polymer materials, has poor dispersibility, and is easy to agglomerate, which will eventually affect the mechanical properties of composite materials.

Therefore, in order to enhance the affinity of boron nitride, its dispersibility in the matrix, surface functional modification is possible. Studies have shown that the surface modification of boron nitride can reduce the viscosity of the composite material and increase the thermal conductivity, and the composite material filled with boron nitride has excellent electrical properties, belonging to high breakdown field strength and high resistance. The materials with high efficiency, low dielectric constant and dielectric loss meet the requirements of electrical and electronic equipment, and the mechanochemical effect modification can optimize the edge performance of composite materials.

All in all, the industry of modified plastics with high thermal conductivity and low dielectric constant is gaining momentum. The addition of modified boron nitride to the polymer matrix can indeed improve the dielectric and thermal conductivity of the polymer and meet the requirements of the 5G electronics industry. The application prospects are considerable. Perhaps the protagonist of this era, it might be the turn of boron nitride?